What is High Power Chip On Board Technology?

Compound Semiconductor

Light Emitting Diode (LED) utilizes compound semiconductor materials, primarily the AlGaInP compound which is able to emit light ranging from Red to Amber wavelength, and the GaInN compound that emits light ranging from Green to Blue wavelength. Both these compounds are created using compound semiconductor materials. LED is generally fabricated from an epitaxy process using MOCVD (Metal Organic Chemical Vapor Deposition) putting p, i, and n layers onto a wafer. After the dicing and binning processes, most companies pack a single LED chip, ranging from 7mils to 40mils square, into a single lamp. Our manufacturer, on the other hand, packs multiple LED chips into a light engine. This means the (Peak™ Series) light engine has greater and more intense light output for light therapy applications.

Advanced Packaging

Most LED lamps contain a single LED chip. Our manufacturer uses advanced technology to pack 50 to 100 LED power chips (power chip means >20 mil square) to a small substrate using COB (Chip-On-Board) technology. This patented COB technology meets the optical, electrical, mechanical and thermal requirements necessary to properly operate a high power LED device.